Each layer of High Bandwidth Memory (HBM) starts as a chip on a wafer, among thousands fabricated together and then diced into individual chips used in the HBM stacking process. Testing and verifying each die on the wafer is critical to success. If even one chiplet in the final stack is defective, the entire system is likely beyond repair.

FormFactor addresses the HBM test challenge with the industry’s most advanced probe architectures, capable of handling thousands of dies in a single touchdown. Our probe cards enable massive parallelism during wafer-level memory testing, ensuring no loss in performance or accuracy.

Watch this episode of FormFactor Mission Central for an overview of the challenges in testing high bandwidth memory and its role in high-end hardware that powers AI, graphics processing, and network-intensive applications.