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IntelliFusion™ Probe Card -300 mm full-wafer contact testing for DRAM and HBM core die
  • IntelliFusion™ Probe Card -300 mm full-wafer contact testing for DRAM and HBM core die
  • IntelliFusion™ Probe Card -300 mm full-wafer contact testing for DRAM and HBM core die

The IntelliFusion probe card delivers advanced test capabilities for 300 mm full-wafer contact testing, tailored for mainstream DRAM and HBM core die. Designed to support both common PCB and contactor-only test applications, IntelliFusion excels in high-volume, high-performance testing environments.

Engineered for complex devices and high-density layouts, IntelliFusion offers unparalleled testing precision and speed. With up to 120,000 probes and support for clock rates of up to 1GHz, this probe card ensures maximum accuracy while operating within a broad test temperature range of -40°C to 130°C. IntelliFusion is equipped with FormFactor’s proprietary Advanced Tester Resource Enhancement (ATRE), which extends up to x16 shared group signals to maximize resource efficiency. Additionally, with its integrated tester-controlled heater, IntelliFusion enables precise thermal management, optimizing probe to pad placement for consistent results and minimized pad area damage.

IntelliFusion is a comprehensive test solution that ensures lower total cost of test, long-life probing, and outstanding performance for high-density, high-complexity devices. Whether testing mainstream DRAM or advanced HBM core die, IntelliFusion provides a robust, future-proof solution for optimizing your wafer test process.

  • 300 mm MLC Architecture & 2D MEMS Springs: IntelliFusion ensures stable electrical performance and minimal wear with uniform scrub marks and non-growing 2D MEMS probes, designed for high-density layouts.
  • 1TD Capability: Supports complex layouts with multiple redistribution layers, compatible with next-gen designs.
  • Up to 120K Probes: Supports up to 120K probes for high-pin-count applications like DRAM, scalable for future needs.
  • Tester-Controlled Heater: Allows precise temperature control for optimized probe placement and flexible adjustments.
  • Field Planarity Adjustment: Quick, easy probe placement optimization, reducing setup time and ensuring reliable pad contact.
  • Wide Temperature Range: Supports testing from -40°C to 130°C, adaptable to various wafer test conditions.
  • ATRE Integration: Enhances test efficiency and reduces test times by sharing tester resources.