ApolloTM MF100 Delivers MEMS Technology that Enables Copper Pillar Packaging Applications at Pitches of 100μm and Below

LIVERMORE, Calif. — June 18, 2013— FormFactor Inc. (Nasdaq: FORM) announced today that it has shipped multiple units of ApolloTM MF100 probe cards to two leading semiconductor foundries. Following an extensive engineering evaluation, the foundries selected the ApolloTM MF100 to test advanced 28nm System-on-Chip products, utilizing copper pillar packaging technology, in volume production.

The transition to copper pillars is happening fast as semiconductor manufacturers deploy the new interconnect structure for its technology and cost advantages. By 2014, more than 50% of bumped wafers for Flip-Chip will be equipped with Cu pillars, and Cu pillar Flip-Chip is expected to grow at a Compound Annual Growth Rate (CAGR) of 35 percent between 2010 and 2018 in terms of wafer count, according to Yole Développement*.

The ApolloTM MF100 expands FormFactor’s position in this high-growth sector. Popularly used for solder bump probing, the ApolloTM platform is now available with a vertical MEMS MF100 probe option creating a new high-precision/low-force technology solution for copper pillar applications. It is a highly customizable platform with application-specific probe options for targeted structures. Geared for multi-DUT (devices under test) testing in high-volume manufacturing environments, the product is optimized for robust performance and high throughput advantages that help lower overall test costs.

“Today’s move marks two important developments,” said Mike Slessor, Sr. Vice President and General Manager of the MicroProbe Product Group. “First, it applies our industry-leading MEMS technology to this high-growth segment of the market; and second, it extends the trusted and well-established ApolloTM vertical platform to our SoC customers’ leading edge products at 28nm and beyond.”

* “Flip-chip Market & Technology Trend – 2013 Business Update” – Yole Développement