FormFactor Executives Discuss IC Wafer Test Technologies and Trends at SEMICON West 2014
July 7, 2014
July 7, 2014
LIVERMORE, Calif. — July 7, 2014 —At SEMICON West this week in San Francisco, executives from FormFactor, Inc. (Nasdaq: FORM) will discuss the company’s newest wafer test technologies at a series of events and forums. SEMICON West is the premier annual conference and tradeshow for the global semiconductor manufacturing industry.
On Tuesday, FormFactor CEO Tom St. Dennis joins a panel of executives to discuss opportunities and challenges for test and packaging technology suppliers in the global marketplace. Moderated by Ron Leckie of Infrastructure Advisors, the panel is titled “Seeking Growth”. It will be held at TechXPOT North from 11:30am-12:30pm.
Test Vision 2020 happens on Wednesday and Thursday at the Marriott Marquis Hotel. Co-sponsored by FormFactor, this premier two-day program gathers executives, technologists and researchers throughout the semiconductor test ecosystem for discussions on IC wafer test trends and novel new technologies. FormFactor executives Amy Leong and Ben Eldridge will present a paper titled “2.5D / 3D wafer probe test challenges and solutions” on Thursday from 10:15-10:45am. Select products from FormFactor’s portfolio will be showcased at this venue.
Also on Wednesday, Tom St. Dennis and FormFactor President Mike Slessor will participate in the Sixth Annual CEO Investor Summit at the W Hotel.
Throughout the show, FormFactor executives will be on hand for customer meetings. To schedule a special briefing, please contact Lisa MacGregor at [email protected].
SEMICON West showcases the world’s best technology companies from across the micro-electronics supply chain and beyond. More information can be found at www.semiconwest.org.