Hybrid MEMS Technology 2.0

Hybrid MEMS technology allows multiple probe designs to be used in a single probe head design, with each probe design optimized for a specific purpose. The technical innovation to enable Hybrid design is to leverage multi-layer composite MEMS fabrication technology, which allows the optimal wafer test performance by including otherwise mutually exclusive requirements such as fine-pitch and high current carrying capability.

Created: June 25, 2019 | Updated: June 25, 2020 | Type: pdf | Size: 1.15 MB

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