June 1, 2023
The new MicroProf PT with SurfaceSens™ technology incorporates a variety of high-precision sensor options to measure the shape of these inter-die connections, as well as thickness, roughness and other characteristics of the film and metal layers that make up each device.
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March 16, 2023
See the presentation and Bastian Troger will share examples of defect inspection on silicon carbide products (SiC layer defects) and the determination of the overlay shift on SiC wafers. In addition, Egidio Carria will discuss the market background and acceptance of SiC technology.
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February 8, 2023
A new module in our Acquire Automation XT metrology software simplifies intuitive fine-tuning. Data View, a new display option integrated into the software, provides instant access to a visual representation of our measurement data.
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April 28, 2022
The characterization of the bonded wafers is essential because it determines the process quality or the quality of the fabricated devices. Along with destructive techniques for the bond strength evaluation, like tensile or shear testing, optical measurements are often the choice of means.
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