June 27, 2024
Advanced packaging is taking the lead as front-end-driven Moore’s Law slows down, shifting the focus from front-end processes to back-end techniques. Where lithography and etching were once the primary enablers, assembly and testing have now gained greater importance.
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March 14, 2024
FormFactor's probe solutions facilitate the required testing environment for aluminum pads through sort and functional speed tests utilizing FFI’s T11 family of probes, as well as for copper bumps with the vertical MEMS MF family.
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January 26, 2024
The demand for cost-effective performance in high-end applications, such as data centers, artificial intelligence, autonomous vehicles, and hyper-realistic graphics, has led to the integration of multiple dies into monolithic systems.
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May 11, 2023
With the emergence of innovative technologies, such as integrating multiple dies into monolithic systems, meeting the increasing demand for cost-effective performance in top-end applications has become more challenging.
Read MoreJuly 12, 2021
Multi-Sensor Measurement – Protecting Against Package Counterfeiting | READ MORE