It’s the end of another year and time to review the top posts of 2024. Here are the top 10 posts of the year.

  1. What is MEMS?
    At the core of cutting-edge wafer probe cards lies the brilliance of MEMS, constituting approximately 75% of the global advanced probe card market. MEMS technology serves as the key to crafting probes with micron-level precision.
  2. Probe Cards for Every IC in Advanced Packages
    Wafer-level testing now spans multiple phases of the production process, positioning FormFactor as a key player in the development of advanced packaging technology. We have probe cards for every IC in advanced packaging.
  3. Moving Silicon Photonics (SiPh) from the Lab to the Fab
    At FormFactor, we’re well aware of the complex requirements SiPh research and development entail. With SiPh pushing the boundaries of photonic test and measurement down to the wafer- and die-level, accurate positioning of optical fibers in three-dimensional space is more essential than ever.
  4. How FormFactor’s Known Good Die Test Enables Advanced Packaging for High Bandwidth Memory
    The demand for high bandwidth computing has catalyzed the development of 3D Heterogeneous modules. These vertically stacked memory packages, designed for High Bandwidth Memory, offer several advantages over conventional modules, including reduced power consumption, significantly increased memory storage, and enhanced performance, all within increasingly compact footprints.
  5. Pharos Vertical and Edge Coupling Low Loss SiPh Wafer Test
    FormFactor’s SiPh solution includes an integrated power measurement function, which quantifies the laser output directly from one of the Pharos fiber channels. This functionality allows users to seamlessly switch from wafer measurements to an auxiliary site, verify the laser power from the probes, automatically position one of the eight channels, and return to the last measured die or subdie to continue testing.
  6. FormFactor and Advantest Collaborate on SiPh Wafer-Level Testing Solution for High-Volume Production
    As silicon photonics (SiPh) continue to transform AI and high-performance computing (HPC), the need for cutting-edge, scalable testing solutions has never been greater. FormFactor and Advantest are at the forefront of this change, announcing a groundbreaking new partnership to accelerate production for silicon photonics and co-packaged optics.
  7. Testing Silicon Photonics and Its Role in Modern Data Centers – NEW VIDEO
    Mike Slessor, FormFactor CEO, discusses silicon photonics testing complexity and impact on data center power consumption in the Mission Central video below – Testing Silicon Photonics and Its Critical Role in Modern Data Centers.
  8. What is Quantum Computing?
    Quantum computing is set to revolutionize a multitude of scientific and engineering domains, offering advancements in personalized medicine, precise weather forecasting, improved battery technologies, and ultra-secure encryption, among other potential applications.
  9. Pyramid Probe: RF Calibration and Probe Aging Considerations in HVM High Speed IO Devices
    The growth in AI (such as ChatGPT and BING AI) is requiring large investments into the expansion of data centers, driving higher and higher data rates in IO devices.  In order to reach these data rates, wafer test is moving to bandwidth > 60 GHz. That said there are some challenges with high-speed wafer test, including considerations related to probe aging.
  10. New Application Note on an Optimized On-Wafer Passive Load Pull System for 5G
    5G, known as the fifth-generation wireless technology, represents the newest advancement in mobile network technology, designed to deliver enhanced speed and reliability for mobile and other internet-connected devices. It improves upon the foundations laid by earlier generations, providing notable advancements in data transmission speeds, reduced latency, and increased network capacity.

Have a safe and happy holiday season! We’ll be back to share more posts in 2025!