The demand for high bandwidth computing has catalyzed the development of 3D Heterogeneous modules. These vertically stacked memory packages, designed for High Bandwidth Memory, offer several advantages over conventional modules, including reduced power consumption, significantly increased memory storage, and enhanced performance, all within increasingly compact footprints.

Year after year, revenues from advanced packaging ICs are on the rise. The emergence of this technology has underscored the importance of performing known good die tests on Through-Silicon Via (TSV) connected memory stacks to minimize risk and cost. Obtaining early test data on stack yields post-manufacture is critical for managing final expenses. FormFactor’s probe solutions facilitate the required testing environment for aluminum pads through sort and functional speed tests utilizing FFI’s T11 family of probes, as well as for copper bumps with the vertical MEMS MF family.

David Cooke, Senior Product Marketing Manager, Memory at FormFactor gave the presentation – How FormFactor’s Known Good Die Test Enables Advanced Packaging for High Bandwidth Memory – at November’s COMPASS Users Conference.

In it, he covered a number of items, including:

Rising Demand of Testing on Advanced Packaging

  • How technology has evolved to 3D packaging
  • Thirst for Big Data – driving need for Advanced Packaging
  • Advanced packaging market overview and trends
  • KGSD Tester Insertions/Options in HBM manufacturing flow

KGSD test requirements challenge probe card design

  • Probe Card solutions on different KGD test applications
  • Recap on 3.2GHz probe card solution
  • Simulation vs. Measurement Result for 4.0GHz probe card solution

At the end of the day, consumers never want less capability; always more. Smaller, faster, cheaper, continually challenges thought on packaging/form factor Vs performance. The key takeaways you’ll achieve by watching this presentation:

  • KGSD Test Demand Increase as Advanced Packaging (HBM) Chip demand Increases Dramatically
  • KGSD Test Requirements Continue to Challenge Probe Card Technology
  • FFI HFTAP probe card technology has validated on production test past 3.0GHz speed and achieved max 128 DUT. Performance and measurement data show promising result on Probe Card support higher speed and parallelism
  • HBM achieves higher bandwidth while using less power in a small form factor. This is achieved by stacking up to eight (maybe 16 in HBM4) DRAM die and an optional base die which can include buffer circuitry and test logic.
  • The old days of using a single die and continuous integration development is fading.
  • 3DIC is the next generation. Integrated Circuits are becoming less Integrated through Advanced Packaging

Visit the COMPASS page to see this and other presentations.