In semiconductor testing, precision, efficiency, and automation are everything. FormFactor’s Velox™ 3.4.3, the latest update to our industry-leading probe station control software, takes these core values to the next level. Packed with powerful new features and enhancements, Velox empowers engineers to tackle complex wafer probing tasks with greater reliability, customization, and ease of use.

Here are seven features and benefits you need to know about this game-changing release.

1) Auto Probe Cleaning – Set It and Forget ItAuto Probe Cleaning Image

Keeping probes clean during wafer testing is critical, but manual cleaning interrupts workflows and introduces variability. With the new Auto Probe Cleaning feature, Velox automates the cleaning process after a set number of touchdowns or consecutive binning fails. This ensures consistent probe performance without constant user intervention.

Benefit: More robust and precise measurements, with less user effort​.


2) Modernized Toolbar for Maximum Customization

The redesigned Velox Toolbar now shines on high-resolution displays. Engineers can monitor system behavior at a glance and configure the toolbar with custom buttons for frequently used commands. Whether you need quick system checks or tailored workflows, the new toolbar puts control at your fingertips.

Benefit: Easier monitoring of system status and warnings, with full user customization​.


3) Smarter RF Automation with Intelligent Error Management

RF calibrations and measurements are notoriously sensitive to errors, but Velox 3.4.3 integrates Intelligent Error Management into the Autonomous RF Measurement Assistant. This ensures robust probe-to-pad alignment and minimizes recovery time during automatic calibrations.

Benefit: More precise and reliable RF measurements, even in challenging conditions​.

 

4) Auto RF Training Wizard Update

Fine-tuning RF probes just got easier. The updated Auto RF Training Wizard allows engineers to set different thresholds for East and West probes, improving blob analysis results when probes vary slightly in appearance. This update ensures greater flexibility and accuracy when working with RF measurements.

Benefit: Better blob analysis results, even when probes look slightly different​.

5) Cluster Support for Multi-Project Wafers

When testing wafers with multi-contact probe cards, efficiency matters. Velox now supports Clusters in Wafer Map, allowing users to group dies for streamlined testing—ideal for multi-project wafers. Visual borders simplify navigation and improve testing workflows.

Benefit: Higher efficiency when handling complex wafer designs​.


6) Enhanced Subdie Binning Display

Seeing is believing. Velox 3.4.3 now displays subdie bin colors directly on the Wafer Map, making it easy to analyze binning results from different measurements. Engineers can quickly isolate and interpret test results without digging through data.

Benefit: Faster, more intuitive subdie binning analysis​.


7) T11 Probe Card Support for ReAlign™

Velox continues to simplify temperature-dependent probe alignment with enhanced ReAlign™ support for T11 Probe Cards. Engineers can now automate probe-to-pad alignment across multiple temperatures, ensuring accuracy throughout the testing process.

Benefit: Seamless automated alignment under varying thermal conditions​ for T11 probe cards.

At its core, Velox 3.4.3 is about delivering unmatched performance and flexibility to engineers who demand precision. Whether you’re managing RF calibrations, automating workflows, or testing multi-die wafers, Velox empowers you to achieve faster, more reliable results.

And the best part? Upgrades are free for existing customers! (Note: Some upgrades may require hardware updates or service visits)​.

Innovation in semiconductor testing doesn’t stand still, and neither should you. Velox 3.4.3 is designed to help engineers push boundaries, reduce downtime, and maintain the precision demanded by today’s cutting-edge technology.

For more information, download the Velox 3.4.3 data sheet.