November 21, 2023
To support the advancement of 6G and beyond mobile communication products, the routine measurement of wafer S-parameters and RF measurements at sub-THz frequencies has become commonplace for test engineers.
November 21, 2023
To support the advancement of 6G and beyond mobile communication products, the routine measurement of wafer S-parameters and RF measurements at sub-THz frequencies has become commonplace for test engineers.
Earlier this month, FormFactor and Keysight Technologies held a Device Modeling Seminar at our San Jose Demo Center. There were a number of fantastic presentations and discussions and we’re pleased to bring you Jason Alikpala’s presentation on-demand – Making Traceable and Accurate sub-THz Measurements for Wafer Test Applications.
To support the advancement of 6G and beyond mobile communication products, the routine measurement of wafer S-parameters and RF measurements at sub-THz frequencies has become commonplace for test engineers. Precision, consistency, and traceability in tests, particularly for active devices, are essential prerequisites as test engineers collaborate across various labs and geographic locations. In this presentation, drawing from published IEEE papers, we will explore how probe tip power calibration, continuity checks in banded sub-THz measurements, monitoring probe tip contact resistance, and implementing best practices in autonomous over-temperature high-frequency measurements can effectively meet these evolving test demands.
Jason is a senior applications engineer with over a decade of experience in RF and DC probes, probe control software and on-wafer calibration at FormFactor. He is an expert in modeling and characterization having led strategic planning and implementation of product releases while serving as R&D manager for Agilent and Hewlett Packard.
He holds a BS in electrical engineering from Cal State Polytechnic University at Pomona.
Follow the link to watch this presentation on demand.