October 17, 2019
COMPASS 2019, our seventh users’ conference is being held November 14th in Munich, Germany, and we have just announced our keynote speaker, E. Jan Vardaman, President and Founder, TechSearch International, and released our agenda.
October 17, 2019
COMPASS 2019, our seventh users’ conference is being held November 14th in Munich, Germany, and we have just announced our keynote speaker, E. Jan Vardaman, President and Founder, TechSearch International, and released our agenda.
COMPASS 2019, our seventh users’ conference is being held November 14th in Munich, Germany, and we have just announced our keynote speaker and released our agenda.
Drivers for Advanced Packaging: 2020 and Beyond
The electronics industry has entered a new era of change. 5G is driving advanced packaging developments in infrastructure and mobile handsets. Electronic content in automotive applications is increasing dramatically. Automobiles are on the threshold of a radical change in technology and this is driving advanced packaging technology. The advanced packaging solution for many of these applications involves heterogeneous integration. This economic solution addresses the end of silicon scaling. This presentation examines the trends and the impact on the advanced packaging market, with a discussion of the type of packages that can be expected.
08:45 – 09:15 Registration and Networking Breakfast
09:15 – 09:25 Welcome and Agenda Overview
09:30 – 10:00 Keynote: “Drivers for Advanced Packaging: 2020 and Beyond” (TechSearch International)
10:00 – 10:30 Technical Session 1: “Investigating the Effects of Input-output Impedances on Power Amplifiers” (Focus Microwave)
10:30 – 11:00 Technical Session 2: “Transferring the Accuracy of Multiline TRL to Industrial Calibrations” (PTB)
11:00 – 11:30 Technical Session 3: “Test Challenges and Solutions for Advanced Packaging” (imec)
11:30 – 12:00 Technical Session 4: “Multi Sensor Metrology Tools for Hybrid Metrology in Wafer Manufacturing” (FRT GmbH)
12:00 – 13:00 Business Break and Lunch
13:00 – 13:30 Technical Session 5: “Benefits of Reduced Insertion Loss for mmWave Over Temperature Wafer Test” (FormFactor)
13:30 – 14:00 Technical Session 6: “High Parallelism Testing of Advanced Image Sensors” (STMicroelectronics)
14:00 – 14:15 Break
14:15 – 14:45 Technical Session 7: “Silicon Photonics Testing” (imec/FormFactor)
14:45 – 14:50 Closing
14:50 – 16:00 Networking Reception
To register for the event or see details on the agenda speakers and topics, be sure to visit the COMPASS 2019 website.