Test Insights Presentations

FormFactor’s Test Insights Presentation Series

Test Insights is a series of short presentations on topics related to semiconductor wafer test and measurement. FormFactor content experts discuss emerging applications and the challenges associated with characterizing and validating their performance. The presentations address new devices, technologies and materials, and the solutions to overcome their specific test and measurement requirements -- from the engineering lab to the production fab.

For more information on any of our topics, contact us.

Solving the Data Center Energy Crisis with Silicon Photonics | Dr. Choon Beng Sia

A deluge of business data flows into corporate data centers each day, faster than anyone can sort through it. At the same time, consumers are communicating, browsing, buying, sharing, and searching—creating their own enormous trails of data and an incredible energy demand at data centers. FormFactor’s Dr Choon Beng Sia presents a paper on the application of Silicon Photonics (SiPh) devices, how these new devices can help lower energy consumption in data centers, why accurate and reliable wafer-level photonics test are needed, and how FormFactor is helping to address the challenges of testing SiPh devices. (Time: 13:25)

5G Production Test Considerations | Dr. Daniel Bock

Bringing 5G to market requires an array of supporting tools to ensure the end products meet expectations. It will require significant performance advances in chip technology and manufacturing processes—all the while keeping price/performance at an economically viable level. In this presentation, Dr. Daniel Bock from FormFactor describes some of the specifications associated with 5G devices and what they are driving in wafer test requirements. (Time 9:28)

Broadband S-parameter Measurement to 130 GHz | Anthony Lord

FormFactor RF Market Director Anthony Lord reviews the challenges of making very high frequency measurements over a broad band, especially at millimeter waves. He discusses the need for device modelling and circuit characterization with high accuracy and repeatability, as well as the challenges of making these measurements over temperature (-40 to as high as +175 degrees C). (Time 10:00)