High Volume
Production Test
Learn how FormFactor products enable the test of virtually all types of chips manufactured today in the high-volume production environment.
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Logic and System-on-a-Chip (SoC)
The decision-making built into modern electronics is powered by a variety of processing devices, from CPUs and GPUs to microcontrollers and more. Learn how FormFactor enables the verification of these chips and lowers the cost of test on the production test floor.
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Memory
Increased data consumption and the growing proliferation of smartphones are driving the demand for DRAM and Flash memory. FormFactor helps manufacturers to speed the verification and lower the cost of testing these devices with high parallelism wafer test solutions.
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RF and 5G
FormFactor is the leader in providing wafer test solutions to the RF industry for communication IC validation. In production, the challenge is testing a broad spectrum of frequencies from RF to millimeter-wave while maintaining high throughput.
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Advanced Packaging
As companies employ advanced packaging techniques, they need cost effective test solutions to move to high volume production. FormFactor is the only test and measurement company that can help customers verify device performance and yield at every stage of system integration.
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AI Processors
AI requires high volume computing power to continually model the behavior of each node during each training cycle. FormFactor technologies overcome the unique thermal challenges of these large, hot devices.
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Optical Devices
FormFactor’s family of optical device probe cards offer customized solutions for testing CMOS image sensors and LED devices.
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Cryogenic Testing
Our high-performance cryogenic probe stations for on-wafer and multi-chip measurements support a wide range of challenging applications, including strategies for enabling quantum test from 77K down to milli-Kelvin.
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Parametric Test
During the manufacturing process, device developers can test structures such as transistors with electrical contact. These structures can be on the metal layer within the die or, in some cases, within the scribe lines. FormFactor parametric solution help manufacturers characterize their performance on wafer.
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