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Advanced Probe Card Solutions to Address HBM Wafer and Stacked Die Test Challenges

Advanced Packaging has evolved significantly over the last few years. High Bandwidth Memory has emerged as the leading revenue growth opportunity for Memory Manufacturers, with 2.5D and 3D package technologies. This discussion is focused on problems Memory Manufacturers face when utilizing probe cards to ensure Known Good Die (KGD) test. Millions of bits are exchanged from GPU to Memory Stacks (9.6 GT/s (gigatransfers per second)) with HBM3e. This dynamic is demanding more power and the ability to handle heat dissipated by each new HBM version, each with an increased number of stacked die which in turn will result in problems for the probe card to withstand this heating and provide stable probe-to-pad alignment. In order to respond to these challenges, we will discuss thermally scaled MEMS technology for sorting and KGD.

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