Action filed in California federal court alleges infringement of four different FormFactor US patents

LIVERMORE, CA — November 20, 2006 — FormFactor, Inc. (Nasdaq: FORM) announced the filing of a patent infringement lawsuit against Micronics Japan Co., Ltd., MJC, a Japanese corporation. The lawsuit, filed in federal district court in California, charges MJC is infringing four US patents that cover key aspects of FormFactor’s wafer probe cards.

Igor Khandros, FormFactor CEO, stated, “FormFactor is committed to delivering mission critical products to its customers and to lowering their overall cost of test. Our commitment is fueled by innovation and the resulting intellectual property rights provide the foundation for our continuing progress.” He added: “We can not condone unauthorized third parties using our proprietary technology and this latest infringement action is a necessary step to protect our investment in research and development.”

The filing of the US complaint against MJC and its subsidiary follows actions initiated by FormFactor in 2004 against Phicom in the Seoul Southern District Court in Korea, and in US federal court in Oregon in 2005. All the cases are still pending and are a part of the Company’s global IP strategy. The US patents asserted in the filing against MJC and its subsidiary are US Patent No. 6,246,247 for “Probe Card Assembly And Kit, And Methods Of Using Same”, US Patent No. 6,509,751 for “Planarizer For A Semiconductor Contactor”, US Patent No. 6,624,648 for “Probe Card Assembly”, and US Patent No. 7,073,254 for “Method For Mounting A Plurality Of Spring Contact Elements”.