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- Create Date September 3, 2021
- Last Updated September 3, 2021
Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probe Cards
Semiconductor manufacturers are on a relentless drive to reduce the total cost of test at sort. A major contributor to reducing cost of test is increasing simulations Device Under Test which requires a subsequent increase in the probe card active area. FormFactor has developed a new probe card architecture to address the challenges of fine pitch, high CCC, and high temperature range for wire bond probing applications.
Attached Files
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challenges-of-expanding-large-area-active-array-for-fine-pitch-vertical-probe-cards.pdf | Download |