Company Achieves Milestone Four Times Faster than with Previous Platform

LIVERMORE, Calif. – September 14, 2010 – FormFactor, Inc. (Nasdaq: FORM) today announced it has achieved a milestone with its new probing platform architecture, marking the shipment of 300 units of TouchMatrixTM and SmartMatrixTM advanced wafer probe cards used by IC manufacturers for full wafer-contact Flash and DRAM device testing. FormFactor’s TouchMatrix and SmartMatrix probe cards enable customers to optimize tester utilization and improve yield thru superior uptime, contact accuracy and signal integrity. The shipment milestone was achieved approximately three quarters after the product was introduced, more than four times faster than FormFactor’s previous full wafer contact platform. The 300th probe card was shipped to a major Flash memory manufacturer, where it is being used for one- touchdown NAND Flash testing.

“As memory product lifecycles accelerate, both DRAM and Flash memory manufacturers face shrinking windows of opportunity to ramp their new designs and require key suppliers to provide operational responsiveness and flexibility to support test operations,” stated Glenn Farris, General Manager of Memory Marketing at FormFactor. “Our new TouchMatrix and SmartMatrix solutions deliver out-of-the box probe performance that offers both technological and operational enhancements to enable DRAM and Flash memory manufacturers to stay on their test roadmaps and lower their cost of test.”

SmartMatrix probe cards offer enhanced probing performance that enables DRAM manufacturers to extend the life of their existing test equipment and avoid the need for additional capital spending within their test cells. At present, the new platform is primarily focused in testing DDR3 devices at the 4x and 5x nodes. TouchMatrix probe cards target NAND device test, offering Flash memory manufacturers superior product performance. The

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TouchMatrix probe card is specifically designed for today’s cost sensitive test flows and enables testing of Flash devices down to 2x-nm process nodes, including those integrating three-bit and four-bit memory cell architectures.

Forward-Looking Statements

Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding business momentum, demand for our products and future growth. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: changes in the market environment, the company’s ability to continue to ramp its production of SmartMatrix and TouchMatrix advanced wafer probe cards based on its new product platform architecture; the level to which the TouchMatrix and SmartMatrix probe cards improve memory manufacturers’ test efficiency and address their advanced product roadmaps and stringent cost-of-test requirements; the capability of TouchMatrix and SmartMatrix probecards to deliver out-of-the box probe performance and to offer enhancements that enable DRAM and Flash memory manufacturers to lower their cost of test; the level to which SmartMatrix probe cards enable DRAM manufacturers to extend the life of their existing test equipment and avoid the need for additional capital spending within their test cells; the level to which TouchMatrix probe cards provide superior product performance with a substantially reduced production lead time; the demand for DRAM and Flash memory devices and certain other semiconductor devices; and the company’s ability to timely deliver new products that meet its customer’s testing requirements and lower their overall cost of test. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company’s Form 10-K for the fiscal year ended December 26, 2009, as filed with the Securities and Exchange Commission (“SEC”), and subsequent SEC filings, including the company’s Form 10-Q for its fiscal quarterly period ending March 27, 2010 and the company’s Form 10-Q for its fiscal quarterly period ending June 26, 2010. Copies of the company’s SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.